Products & Capabilities
Advancing semiconductor manufacturing with precision materials, skilled talent, and sustainability aligned to India’s national vision.
At Kinesis Semiconductor Wire Solutions India Pvt Ltd, we deliver a comprehensive portfolio of bonding wire products engineered for performance, reliability, and scalability. Our solutions are tailored to meet the stringent requirements of Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Test (OSAT) providers.
Our Mission
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Deliver high-performance bonding wire solutions tailored for IDMs and OSATs
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Build resilient, traceable, and cost-effective supply chains
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Empower industrial talent through training and cross-border knowledge transfer
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Embed ESG principles across materials, processes, and governance
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Align with India’s National Semiconductor Mission and global sustainability goals
Our Products
Our bonding wires are engineered to meet the stringent requirements of advanced semiconductor packaging and assembly processes.
Gold Bonding Wire
Features high purity and customizable diameters with optimized Heat-Affected Zones (HAZ) for superior arc stability. Ideal for advanced IC packaging and high-reliability devices.
Silver & Silver Alloy Bonding Wire
A cost-effective solution with excellent bondability, low resistance, and high reliability. Optimized for optoelectronics and high-volume manufacturing.
Copper Bonding Wire
Offers competitive pricing with strong mechanical properties and excellent electrical conductivity. Best suited for discrete components (SOT, SOP, QFN) and cost-efficient integrated circuits.
Manufacturing Capabilities & Process Excellence
Our operations are built on a foundation of precision and innovation, utilizing a rigorous "core process flow" to ensure product uniformity.
The Production Journey
1
Melting & Alloying
High-purity metals are melted under controlled conditions with proprietary formulations to enhance bondability and reliability.
2
Crystallization
Controlled solidification creates a precise microstructure for optimal conductivity.
3
Drawing & Winding
Wire is drawn to exact diameters and wound for stability and ease of handling in subsequent processes.
4
Annealing
Heat treatment optimizes ductility, elongation, and breaking load properties.
5
Packing
Finished products are packaged under strict quality protocols for full customer assurance.
Quality Assurance:
The QbWMe Mindset
Quality is not just a department; it is a mindset embedded across our entire value chain.
Our commitment to quality is driven by advanced testing capabilities, utilizing ICP equipment, tensile strength testers, and rigorous wire release validation to guarantee peak performance. We ensure full compliance with international standards through a system of complete batch traceability, providing total transparency across the value chain. By focusing on technical excellence, such as achieving slow intermetallic compound growth and high loop stability, we significantly improve long-term device reliability for our customers.